Chips

eMMC

Embedded MultiMediaCard for embedded storage applications

Consistent storage performance
Low power consumption
Nonvolatile storage
Wide operating temperature range
High reliability
Compact package: 153 balls, 11.5 × 13 mm
Applications include smartphones, tablets, digital cameras, personal digital assistants, portable media players, and GPS devices

UFS

Applications include smartphones, tablets, digital cameras, personal digital assistants, portable media players, and GPS devices

Consistent storage performance
Low power consumption
High-speed read and write operations
Wide operating temperature range
High reliability
Compact package: 153 balls, 11.5 × 13 mm
Applications include smartphones, tablets, digital cameras, personal digital assistants, portable media players, and GPS devices

eMCP

Embedded Multi-Chip Package: an energy-efficient solution combining memory and storage for embedded applications

LPDDR

Low-Power Double Data Rate memory designed for high-speed operation and low power consumption

Data rate: up to 4,266 Mb/s
Low power consumption
Data transfer bandwidth: up to 17 GB/s
Wide operating temperature range
Package: 200 balls, 10.00 × 14.50 mm
Applications include mobile phones, tablets, laptops, networking equipment, connected healthcare devices, and smart devices

BGA

Ball Grid Array packaging for high-density assembly, designed to provide reliable interconnections, compatibility with a range of chips and modules, and improved thermal performance.

Reliable interconnections
Compatible with a range of chips and modules
Improved thermal performance
Compact package options: 132 balls, 12 × 18 mm; 252 balls, 14 × 18 mm; 272 balls, 14 × 18 mm
Applications include drones, tablets, and mobile phones